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Low Thermal Conductivity Phenolic Foam Insulation Board 30 mm Closed Cell

Basic Properties

Place of Origin:China
Brand Name:MYREAL
Certification:ISO、SGS、CE
Model Number:PF-B30

Trading Properties

Minimum Order Quantity:1 carton
Standard Packaging:Cartons / PE Bags
Delivery Time:2-3weeks
Payment Terms:T/T
Supply Ability:Subject to order quantity and specifications
Specifications
Product Name: Low Thermal Conductivity Phenolic Foam Insulation Board Product Type: Foil Faced Rigid Phenolic Foam Board
Core Material: Rigid Phenolic Foam, Closed Cell, CFC Free Density: 40 - 55 Kg/m3
Thermal Conductivity: <= 0.032 W/(m.K) At 10 C Mean Temperature Compressive Strength: >= 0.10 MPa (100 KPa)
Dimensional Stability: <= 2.0% After 7 D At -40 / 70 / 130 C Oxygen Index: >= 38%
Smoke Density Ratio: <= 10 Service Temperature: -40 To 130 C
Thickness: 30 Mm Application: Duct Lining And Interior Wall Insulation With Limited Depth
Thermalconductivity: 0.018-0.025 W/m·K Materialtype: Phenolic Resin
Applicationareas: Building Insulation, HVAC, Refrigeration Usage: Construction
Chemicalresistance: Resistant To Acids And Alkalis Type: Rock Wool
Acousticinsulation: Good Sound Absorption Properties Closedcellcontent: >90%
Shape: Sheet Formfactor: Panels, Blocks, Or Spray-applied
Productname: Phenolic Foam Fireresistance: Class A1 (non-combustible)
Thermal Conductivity: 0.041 W/mK Design Style: Modern
Compressivestrength: 0.2-0.5 MPa
Product Description

Low Thermal Conductivity Phenolic Foam Insulation Board 30 mm Closed Cell

Low thermal conductivity is the reason phenolic foam holds a place in tight construction. At a mean temperature of ten degrees the foam measures 0.032 W/(m.K), which lets a 30 mm board do the work of roughly 45 mm of EPS. For a duct lining or a wall where depth is fixed, that difference decides whether the design fits.

The low thermal conductivity comes from a fine, uniform cell structure rather than from heavy density. The board stays light at forty to fifty five kilograms per cubic metre, so installers can carry a full sheet up a ladder, and the closed cells keep moisture out of the foam in humid service.

Boards are laminated on a continuous line with embossed aluminium foil on both faces, and the non woven interlayer gives a reliable bond between foil and foam. The result is a low thermal conductivity phenolic foam insulation board that holds its declared value after handling, cutting and fixing on site.

Key Advantages

  • Conductivity of 0.032 W/(m.K) at 10 C mean temperature
  • Fine closed cell structure keeps the value stable in humid service
  • Light board weight at 40 to 55 kg/m3 for easy handling
  • Foil facing on both sides adds a reflective surface
  • Dimensional change within 2.0% after 7 days at 130 C
  • Cuts cleanly with a fine tooth saw and leaves a square edge

Technical Specifications

product nameLow Thermal Conductivity Phenolic Foam Insulation Board
Product TypeFoil faced rigid phenolic foam board
Core MaterialRigid phenolic foam, closed cell, CFC free
Density40 - 55 kg/m3
Thermal Conductivity<= 0.032 W/(m.K) at 10 C mean temperature
Compressive Strength>= 0.10 MPa (100 kPa)
Dimensional Stability<= 2.0% after 7 d at -40 / 70 / 130 C
Oxygen Index>= 38%
Smoke Density Ratio<= 10
Service Temperature-40 to 130 C
Thickness30 mm
ApplicationDuct lining and interior wall insulation with limited depth

Typical Applications

  • Duct lining where build up depth is limited
  • Interior wall insulation in refurbishment
  • Ceiling and soffit insulation
  • Cold service pipe and vessel cladding
  • Transport and container linings
  • Modular building wall panels

Frequently Asked Questions

Q: Is 0.032 W/(m.K) measured at 10 C or 25 C?

A: Our declared figure is measured at a 10 C mean temperature, which matches European phenolic board declarations. Data at other mean temperatures is available.

Q: How does it compare with PIR at the same thickness?

A: Phenolic foam is slightly better in lambda and considerably better in high temperature dimensional stability, which is why it suits hot pipe and duct work.

Q: Does the foil facing need to be removed before gluing?

A: No. The foil is bonded to the foam, and adhesive is applied to the foil surface after a light keying with an abrasive pad.

Q: Can the board be supplied without foil?

A: Yes, plain board is available for lamination into your own sandwich panels.

MYREAL produces low thermal conductivity phenolic foam insulation boards on a continuous lamination line in Shanghai and supplies projects in Europe, the Middle East and Southeast Asia. Contact our technical team for datasheets, samples and test reports.

Contact Details
Myreal Energy Saving (Shanghai) Co., Ltd.

Contact Person: Mrs. Betsy Ouyang

Tel: +86 17740800950

Send your inquiry directly to us
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