Low Thermal Conductivity Phenolic Foam Insulation Board 30 mm Closed Cell
Basic Properties
Trading Properties
| Product Name: | Low Thermal Conductivity Phenolic Foam Insulation Board | Product Type: | Foil Faced Rigid Phenolic Foam Board |
|---|---|---|---|
| Core Material: | Rigid Phenolic Foam, Closed Cell, CFC Free | Density: | 40 - 55 Kg/m3 |
| Thermal Conductivity: | <= 0.032 W/(m.K) At 10 C Mean Temperature | Compressive Strength: | >= 0.10 MPa (100 KPa) |
| Dimensional Stability: | <= 2.0% After 7 D At -40 / 70 / 130 C | Oxygen Index: | >= 38% |
| Smoke Density Ratio: | <= 10 | Service Temperature: | -40 To 130 C |
| Thickness: | 30 Mm | Application: | Duct Lining And Interior Wall Insulation With Limited Depth |
| Thermalconductivity: | 0.018-0.025 W/m·K | Materialtype: | Phenolic Resin |
| Applicationareas: | Building Insulation, HVAC, Refrigeration | Usage: | Construction |
| Chemicalresistance: | Resistant To Acids And Alkalis | Type: | Rock Wool |
| Acousticinsulation: | Good Sound Absorption Properties | Closedcellcontent: | >90% |
| Shape: | Sheet | Formfactor: | Panels, Blocks, Or Spray-applied |
| Productname: | Phenolic Foam | Fireresistance: | Class A1 (non-combustible) |
| Thermal Conductivity: | 0.041 W/mK | Design Style: | Modern |
| Compressivestrength: | 0.2-0.5 MPa |
Low Thermal Conductivity Phenolic Foam Insulation Board 30 mm Closed Cell
Low thermal conductivity is the reason phenolic foam holds a place in tight construction. At a mean temperature of ten degrees the foam measures 0.032 W/(m.K), which lets a 30 mm board do the work of roughly 45 mm of EPS. For a duct lining or a wall where depth is fixed, that difference decides whether the design fits.
The low thermal conductivity comes from a fine, uniform cell structure rather than from heavy density. The board stays light at forty to fifty five kilograms per cubic metre, so installers can carry a full sheet up a ladder, and the closed cells keep moisture out of the foam in humid service.
Boards are laminated on a continuous line with embossed aluminium foil on both faces, and the non woven interlayer gives a reliable bond between foil and foam. The result is a low thermal conductivity phenolic foam insulation board that holds its declared value after handling, cutting and fixing on site.
Key Advantages
- Conductivity of 0.032 W/(m.K) at 10 C mean temperature
- Fine closed cell structure keeps the value stable in humid service
- Light board weight at 40 to 55 kg/m3 for easy handling
- Foil facing on both sides adds a reflective surface
- Dimensional change within 2.0% after 7 days at 130 C
- Cuts cleanly with a fine tooth saw and leaves a square edge
Technical Specifications
| product name | Low Thermal Conductivity Phenolic Foam Insulation Board |
| Product Type | Foil faced rigid phenolic foam board |
| Core Material | Rigid phenolic foam, closed cell, CFC free |
| Density | 40 - 55 kg/m3 |
| Thermal Conductivity | <= 0.032 W/(m.K) at 10 C mean temperature |
| Compressive Strength | >= 0.10 MPa (100 kPa) |
| Dimensional Stability | <= 2.0% after 7 d at -40 / 70 / 130 C |
| Oxygen Index | >= 38% |
| Smoke Density Ratio | <= 10 |
| Service Temperature | -40 to 130 C |
| Thickness | 30 mm |
| Application | Duct lining and interior wall insulation with limited depth |
Typical Applications
- Duct lining where build up depth is limited
- Interior wall insulation in refurbishment
- Ceiling and soffit insulation
- Cold service pipe and vessel cladding
- Transport and container linings
- Modular building wall panels
Frequently Asked Questions
Q: Is 0.032 W/(m.K) measured at 10 C or 25 C?
A: Our declared figure is measured at a 10 C mean temperature, which matches European phenolic board declarations. Data at other mean temperatures is available.
Q: How does it compare with PIR at the same thickness?
A: Phenolic foam is slightly better in lambda and considerably better in high temperature dimensional stability, which is why it suits hot pipe and duct work.
Q: Does the foil facing need to be removed before gluing?
A: No. The foil is bonded to the foam, and adhesive is applied to the foil surface after a light keying with an abrasive pad.
Q: Can the board be supplied without foil?
A: Yes, plain board is available for lamination into your own sandwich panels.
MYREAL produces low thermal conductivity phenolic foam insulation boards on a continuous lamination line in Shanghai and supplies projects in Europe, the Middle East and Southeast Asia. Contact our technical team for datasheets, samples and test reports.
Contact Person: Mrs. Betsy Ouyang
Tel: +86 17740800950